PIEE-IN-PIPE WITH PLATE TECHNOLOGY:

The concept of this technology has come several years of R & D. In this, we have given maximum area and better design for discharging of current.

In this technology we have two B or C class pipe and two 2 to 3 mm thick plate of G.I. or copper whichever is required. Inner plates are cut in arrow dynamic shape and plate is first fixed on the inner pipe and then all plate and pipe are put into the outer pipe.

For uniform distribution of fault current and earthing electrode must be cylindrical & aerodynamic in shape. This facilitates uniform distribution of fault current for electrode to the earth (as per IS: 3043)

This current density is usually high in soil within a few feet of the electrode surface. The density should be as low as possible, which should be such as to cause the current density to decrease rapidly with in a distance from the electrodes. Thus a pipe electrode has a much lower resistance than a plate of equal surface area.